Chemical Mechanical Polishing in Silicon Processing by

Read or Download Chemical Mechanical Polishing in Silicon Processing PDF

Best chemistry books

Radioactivity in the Environment: Physicochemical aspects and applications

Quite a few assets of ionizing radiation may end up in human publicity: usual assets, nuclear explosions, nuclear strength new release, use of radiation in clinical, business and learn reasons, and radiation emitting purchaser items. sooner than assessing the radiation dose to a inhabitants one calls for an actual wisdom of the job of a few radionuclides.

The Chemistry of Metal Enolates (Chemistry of Functional Groups)

Steel Enolates shape a category of compounds that experience lately got a lot examine as a result of their half within the vital C-C-bond forming aldol response. targeting this crucial classification of compounds in natural synthesis, The Chemistry of steel Enolates positive factors contributions on all elements of steel Enolate chemistry from the area?

Colloid and interface chemistry for water quality control

Colloid and Interface Chemistry for Water quality controls offers uncomplicated yet crucial wisdom of colloid and interface technological know-how for water and wastewater remedy. Divided into sections, chapters 1 to 8 presents colloid chemistry together with basic heritage and uncomplicated recommendations, diffusion and Brown movement, sedimentation, osmotic strain, optical houses, rheology homes, electrical homes, emulsion, foam and gel, etc; chapters nine to offers interface chemistry theories together with the outside of liquid, the outside of resolution, and the skin of stable.

Extra resources for Chemical Mechanical Polishing in Silicon Processing

Sample text

C. Kaanta, W. Cote, J. Cronin, K. -I. Lee, T. Wright, “Submicron Wiring Technology with Tungsten and Planarization,” Int. Deu. Meeting Technical Digest, pp. 209-212, 1987. 2. S . Pennington, S. Luce, “Improved Process Latitude with Chemical-Mechanical Polishing,” Proceedings of the VMIC Conference, pp. 168-172 Santa Clara, CA, June 9-10, 1992. 3. J. M. Steigerwald, S . P. Murarka, R. J. , 1997. 4. K. Holland, T. 35pm and Beyond,” SEMI Technical Symposium, Makuhari Messe, Chiba, Japan, Dec. 4-6, 1996.

Pneumatic pressure is applied through an inlet resulting in hydrostatic pressure directly against the wafer. There is not necessarily any independent retaining ring control. 9. (a) The distributed polish head extends the concept of hydrostatic pressure by integrating polish blocks in the carrier design to ensure that locally the spatial variation in the polish pressure is low. (b) Schematic representation of the region on a wafer that a polish block may contact. it is absent. In one invention, the pressure applied to the retaining ring is adjusted separately from that of the carrier [33].

Other CMP applications do not require such aggressive pad conditioning. For example, pad conditioning for tungsten plug CMP is done with a conditioner. Pad conditioning is also used to shape the pad during polishing to improve uniformity. Figure 13 shows a plot of the pad thickness after polishing 481 wafers on a rotational platform. The bar in the figure indicates the location of the wafer during polish. The effect of pad conditioning on shaping the pad is evident. For the process shown in the figure, the pad was curved to enhance the removal rate in the center of the wafer.

Download PDF sample

Rated 4.46 of 5 – based on 20 votes